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Power Packages
TO-263

TO-263, the surface-mount package version of the TO-220 package, comes in 2, 3, and 5 leads options. One of the advantages of our TO-263 package is its capability to accommodate large dice, owing to its large pad design. This package is ideal for high power applications due to its low resistance. Typical applications for this package are in home appliances and personal computers.

Package Type & 
Lead Count

TO-263
(2 / 3 / 5 Leads)

Dimensions

Package Dimension

Die Pad Dimension

Maximum Die Size

400 x 340 x 175 mils

226 x 170 mils

202 x 150 mils

Materials 

Lead Frame

Die Attach

Wirebond

Mold Compound

TAMAC2, PMC90

Epoxy, Soft Solder

Aluminum, Gold Wire

MG15F-0140
CK6000HV

Power Dissipation
38 - 230 Watts*
Thermal Resistance

Junction-to-Ambient

Junction-to-Case

50 - 80 ºC/W*

0.8  - 3.3 ºC/W*

Electrical Performance

Voltage Rating

Current Rating

600 Volts*

80 Amperes*

Product Applications

Diodes (Small Signal Diodes, Zener Diodes)
Small Signal & Switching Transistors (Bipolar Small Signal Transistors, Field Effect Transistors)
Power Transistors (Bipolar General Purpose Power Transistors, Field Effect General Purpose Power Transistors, Insulated Gate Bipolar Transistors)
Rectifiers (Power Diodes)
Thyristors
Standard Linear Analog (Amplifiers, Voltage Regulators & References)
MOS Logic (MOS General Purpose Logic)

* Customer Product Data

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