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Power Packages
TO-251 (IPAK) / TO-252(DPAK)

These low to medium power packages are configured for through-hole (TO-251)or surface-mount (TO-252) applications. The leadframes for these packages have been designed to give the user the choice of either spot silver pad/copper or full nickel plate to cater to gold and aluminum wire bonding process, respectively.

Common applications for TO-251 and TO-252 packages are home appliances, personal computers, lighting and automotive systems.

Package Type & 
Lead Count

TO-251 / TO-252
(2 and 5 Leads)

Dimensions
TO-251 ( 3 Leads )

Package Dimension

Die Pad Dimension


Maximum Die Size

 

260 x 240 x 90 mils

158 x 116 mils ( option 1 & 2)
190 x 140 mils ( option 3 & 4)

134 x 96 mils
166 x 122 mils

Dimensions
TO-252 ( 2 / 3 Leads )

Package Dimension

Die Pad Dimension


Maximum Die Size

 

260 x 240 x 90 mils

158 x 116 mils (option 1 &2)
190 x 140 mils (option 3 & 4)

134 x 96 mils
166 x 122 mils

Dimensions
TO-252 ( 4 / 5 Leads )

Package Dimension

Die Pad Dimension

Maximum Die Size

260 x 240 x 90 mils

158 x 116 mils

134 x 96 mils

Materials 

Lead Frame

Die Attach

Wirebond

Mold Compound

 

KFC, HCL12S

Epoxy, Soft Solder

Aluminum Wire, Gold Wire

EME6300H
MP195
KTMC5400G (Green)
KTMC1030NA Red
CK6000HV

Power Dissipation
20 - 100 Watts*
Thermal Resistance

Junction-to-Ambient

Junction-to-Case

50 to 100 ºC/W*

1.5 – 8.0 ºC/W*
Electrical Performance

Voltage Rating

Current Rating

800 Volts*

50 Amperes*

Product Applications

Diodes (Small Signal Diodes, Zener Diodes)
Small Signal & Switching Transistors
(Bipolar Small Signal Transistors, Field Effect Transistors)
Power Transistors (Bipolar General Purpose Power Transistors, Field Effect General Purpose Power Transistors, Insulated Gate Bipolar Transistors)
Rectifiers (Power Diodes)
Thyristors
Standard Linear Analog (Amplifiers, Voltage Regulators & References)
MOS Logic (MOS General Purpose Logic)

* Customer Product Data

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