Power Packages
PowerQFN 3 x 3 mm


Package Type

Power QFN 3 x 3 mm


Package Dimension

Die Pad Dimension

Maximum Die Size

18.1 x 118.1 x 39.4 mils

99.2 x 82.7 mils

82.3 x 66.7 mils

Lead Frame

Die Attach

Clip Frame (Option)

Wirebond (Option)

Molding Compound

Lead Finish


Solder Paste
88Pb/10Sn/02Ag, 95Pb/5Sn


Al/Gold/Al ribbon

"Green" material

100% Sn

Package Characteristics

Power Dissipation

Thermal Resistance

Electrical Performance
   Voltage Rating
   Current Rating

0.7 Watt

120 ºC/W

320 Volts
0.15 Ampere

Product Applications

Diodes (Small Signal Diodes, Zener Diodes)
Small Signal and Switching Transistors (Bipolar Small Signal Junction Transistors, Field Effect Transistors)
Thyristors, Standard Linear Analog (Amplifiers, Voltage Regulators and References)
MOS Logic

Note: Values indicated in the PowerQFN packages electrical and thermal characteristics are from customers' product data.

Copyright © 2012 • PSi Technologies, Inc. • All Rights Reserved.