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Power Packages
PowerQFN 3.3 x 3.3 mm

 

Package Type

Power QFN 3.3 x 3.3 mm

Dimensions

Package Dimension

Die Pad Dimension

Maximum Die Size

129.9 x 129.9 x 39.4mils

114.2 x 86.6 mils

98.2 x 70.6 mils
Materials 

Lead Frame

Die Attach


Clip Frame (Option)

Wirebond (Option)

Molding Compound

Lead Finish

C194

Solder Paste
88Pb/10Sn/02Ag, 95Pb/5Sn

C194

Al/Gold/Al ribbon

"Green" material

100% Sn

Package Characteristics


Power Dissipation

Thermal Resistance
   Junction-to-Ambient
   Junction-to-Case

Electrical Performance
   Voltage Rating
   Current Rating


69 Watts


45 ºC/W
2 ºC/W


40 Volts
40 Amperes

Product Applications

Diodes (Small Signal Diodes, Zener Diodes)
Small Signal and Switching Transistors (Bipolar Small Signal Junction Transistors, Field Effect Transistors)
Thyristors, Standard Linear Analog (Amplifiers, Voltage Regulators and References)
MOS Logic

Note: Values indicated in the PowerQFN packages electrical and thermal characteristics are from customers' product data.

Copyright © 2012 • PSi Technologies, Inc. • All Rights Reserved.