Historically, our first product offerings were for other standard applications including metal cans for devices such as field effect transistors and diodes, ceramics for amplifiers and smart displays for cellular phones. Since 1995, however, we have focused primarily on providing power semiconductor assembly and test services and packaging. Although the portion of our business coming from other standard packages represent less than 5% of our revenue, we continue to offer a limited number of standard non-power semiconductor packages such as ceramic-based packages like CERDIP, CERPACK, flatpack and CLCC and metal can packages. These packages find wide applications in industrial, communication, automotive and military fields.
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